Work

ESD Challenges in 300nm Si Substrate of DTCO/STCO Scaling Options

Year: 2023

Type: conference-paper

Source: Technical digest - International Electron Devices Meeting/Technical digest

DOI: 10.1109/iedm45741.2023.10413663

Authors: W.-C. Chen, S.-H. Chen, A. Veloso, K. Serbulova, G. Hellings, G. Groeseneken

Institutions: IMEC, KU Leuven

Language: English

Topic: Electrostatic Discharge in Electronics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4391622697

FWCI: 0.448

Cites:

Cited by: 1

Related to: 10