Work

Effect of Structure to Promote Organic Residue Removal during Cu Post-Chemical Mechanical Planarization (p-CMP) Cleaning

Year: 2023

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2023-02653134mtgabs

Authors: Abigail L. Dudek, Adam T. Caridi, Kevin R Reyes, Jason J. Keleher

Institution: Lewis University

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Responsible consumption and production

Open Access status: closed

OpenAlex ID: W4391662828

Cites:

Cited by: 1

Related to: 10