Unraveling the Slurry/Substrate Interfacial Reaction Mechanism for Wide Band Gap (WBG) Chemical Mechanical Planarization (CMP)
Year: 2023
Type: conference-abstract
Source: ECS Meeting Abstracts
Institution: Lewis University
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4391663133
