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Stimuli-Responsive CeO2 Removal Via Surface Redox Modulation during Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP)

Year: 2023

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2023-02653122mtgabs

Authors: Tatiana R. Cahue, Ryan J. Gentile, Jason J. Keleher

Institution: Lewis University

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4391663384

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