Work

Decoupling and Reconstruction of Low-Quality Temperature Fields of Printed Circuit Boards

Year: 2024

Type: article

Source: IEEE Sensors Journal

DOI: 10.1109/jsen.2024.3365875

Authors: Zhangwei Wang, Haiwen Yuan, Jianxun Lv, Chengxin Liu, Jinmeng Li, Hai Xu

Institutions: Beihang University, Nanjing University of Aeronautics and Astronautics

Language: English

Topic: Thermography and Photoacoustic Techniques

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Key Research and Development Program of China, Academic Excellence Foundation of BUAA for PHD Students

Award: G489516349

OpenAlex ID: W4392016161

FWCI: 0.902

Cites: 34

Cited by: 7

Related to: 10