Tsv Aware 3d Ic Design with Area and Wirelength Optimization
Year: 2024
Type: preprint
Source: SSRN Electronic Journal
DOI: 10.2139/ssrn.4734324
Authors: Atul Prakash, Amit Prakash Sen, Rajesh k. Lal
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4392017223