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Chip-Package Interaction: A Case Study Applied To A Mature Technology Node

Year: 2023

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc59621.2023.10457797

Authors: Eng Chye Chua, Frank Kuechenmeister, Holm Geisler, Kashi Vishwanath Machani, Hin Kiong Yap

Institutions: GlobalFoundries (Singapore), GlobalFoundries (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4392969578

FWCI:

Cites: 6

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Related to: 10