Work

Soft and Damping Thermal Interface Materials with Honeycomb‐Board‐Mimetic Filler Network for Electronic Heat Dissipation

Year: 2024

Type: article

Source: Small

DOI: 10.1002/smll.202400115

Authors: Wenjie Liu, Yijie Liu, Shujing Zhong, Jie Chen, Zhe Li, Chongyin Zhang, Pingkai Jiang, Xingyi Huang

Institution: Shanghai Jiao Tong University

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Program of Shanghai Academic Research Leader

Awards: G196745517, G664272275, G6970390592, G7276076305

OpenAlex ID: W4395962033

FWCI: 1.487

Cites: 63

Cited by: 17

Related to: 10