Work

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Year: 2024

Type: conference-paper

Source: Optical Fiber Communication Conference

DOI: 10.1364/ofc.2024.tu3a.4

Authors: Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout

Institution: IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4396891963

FWCI: 6.807

Cites: 2

Cited by: 10

Related to: 10