Work

Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison

Year: 2024

Type: conference-paper

Source: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00181

Authors: Tae-Kyu Lee, Yujin Park, Gnyaneshwar Ramakrishna, Jonghyun Nam, Daljin Yoon, Heera Roh

Institutions: Cisco Systems (United States), SK Hynix (South Korea)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Portland State University

OpenAlex ID: W4400034026

FWCI: 0.804

Cites: 5

Cited by: 1

Related to: 10