Work

Multi-material Corner Singularity in Electronic Packaging: Avoiding Mesh Dependence in Analyzing Stress

Year: 2024

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00046

Authors: Yaxiong Chen, Torsten Hauck, Ganesh Subbarayan

Institutions: NXP (United States), NXP (Germany), Purdue University West Lafayette

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4400034040

FWCI:

Cites: 13

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Related to: 10