Work

Integrated Design Ecosystem for Chiplets Heterogeneous Integration and Chip-to-Chip Interconnects in Advanced Packaging Technology

Year: 2024

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00168

Authors: Lihong Cao, Chen-Chao Wang, Chih-Yi Huang, Hung-Chun Kuo

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4400034751

FWCI: 4.765

Cites: 6

Cited by: 7

Related to: 10