Influence of Cold Plasma on Material Removal Behavior During Scratching of Single Crystal Silicon
Year: 2024
Type: preprint
Source: SSRN Electronic Journal
DOI: 10.2139/ssrn.4943093
Institution: Dalian University of Technology
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4402115809