Work

Investigating the Failure Mechanisms of Electromigration and Copper Oxide Formation in Fine-Pitch Cu RDL

Year: 2024

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc60143.2024.10712040

Authors: Adrija Chaudhuri, Johannes Jaeschke, Astrid Gollhardt, Hermann Oppermann, Martin Schneider-Ramelow

Institutions: Fraunhofer Institute for Reliability and Microintegration, Technische Universität Berlin

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403421079

FWCI: 5.86

Cites: 19

Cited by: 4

Related to: 10