Work

Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

Year: 2024

Type: article

Source: Nature Electronics

DOI: 10.1038/s41928-024-01268-z

Authors: Dong Hae Ho, Chenhao Hu, Ling Li, Michael D. Bartlett

Institution: Virginia Tech

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Science Foundation, Virginia Polytechnic Institute and State University, Office of Naval Research

Awards: CAREER: Manufacturing Soft Functional Composites through Mechanically Induced Assembly of Liquid Microstructures in Elastic Films, G94638616

OpenAlex ID: W4403734249

FWCI: 5.815

Cites: 52

Cited by: 59

Related to: 10