Work

Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method

Year: 2024
Type: book-chapter
Abstract: —This paper presents an analytical study of a quasi-coaxial via implemented in an IC substrate using the multiple-scattering method. The plate-via impedance matrix is derived using addition theorems for cylindrical inward and outward waves around the vias. This matrix is then utilized to determine the loop inductance, taking into account the via-barrel radius. The derived equations facilitate the investigation of loop inductance, which serves as a figure of merit for the quasi-coaxial configuration. Additionally, the paper includes a statistical analysis that accounts for design parameter uncertainties from via manufacturing point of view.
Institution: AT&S (Austria)
Language: English
Open Access status: hybrid
OpenAlex ID: W4404247237
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Cites: 1
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Related to: 10