Sub-THz Transceiver Design for Future Generation Mobile Communications
Year: 2024
Type: book-chapter
Abstract: —This paper outlines the design considerations necessary to realize an innovative transceiver prototype for future-generation mobile communication, adeptly harnessing the spectrum beyond 100 GHz. The primary innovations and challenges reside in maximizing the efficacy of BiCMOS and indium phosphide technologies, advanced radio frequency (RF) packaging, and the design of high-performance D-band RF frontends. The selection of RF-chip technologies and the integration of densely packed RF packaging are thoroughly defined and justified. Specifications for both transmitter and receiver systems are derived from a meticulous link budget analysis. These preliminary studies and decisions inform the forthcoming tape-outs in this project. The focus remains on developing key transceiver technologies to drive the next generation of mobile communications, surpassing the capabilities of 5G. This includes enhancing data rates, power efficiency, integration density, and minimizing footprint.
Source: River Publishers eBooks
Authors: G. Mangraviti, C. Dehos, V. Puyal, O. Richard, G. Yaakoubi Khbiza, F. Foglia Manzillo, X. V. L. Nguyen, F. Filice, E. Noccetti, P. L. Hellier, F. Podevin, S. Bourdel, A. Ruffino, K.-S. Choi, B. Abdelaziz Abdelmagid, M. Eleraky, H. Wang, B. Ardouin, T. K. Johansen, L. Fanori, Q. Huang, E. Schlaffer, P. Wambacq, D. Morche, B. Debaillie
Institutions: IMEC, Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, University of Pisa, Techniques of Informatics and Microelectronics for Integrated Systems Architecture, ETH Zurich, III V Lab, Technical University of Denmark, AT&S (Austria)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W4404248024