Work

Multiphysics Simulation and Measurement Correlation of a Multichip Module IC Package Current Sensor

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10753691

Authors: Rajen Murugan, Jie Chen, Guangxu Li, Yutaka Suzuki, Sylvester Ankamah-Kusi

Institution: Texas Instruments (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404577458

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