Comparison of strength degradation for SnAgCu solders with various Ag contents during thermal cycling
Year: 2024
Type: article
Authors: Xiaojing Wang, Quanzhen Li, Youchen Zhang, Shanshan Cai, Mahmoud M. Hessien, Ahmed M. Fallatah, Ning Liu, Xiaohong Yuan, Salah M. El-Bahy
Institutions: Jiangsu University of Science and Technology, Taif University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
Funder: Taif University
Award: G1135820088
OpenAlex ID: W4405073763