Work

Addressing interconnect challenges for enhanced computing performance

Year: 2024

Type: review

Source: Science

DOI: 10.1126/science.adk6189

Authors: Joon-Seok Kim, Joonyun Kim, Dae-Jin Yang, Jaewoo Shim, Luhing Hu, Chang‐Seok Lee, Jeehwan Kim, Sang Won Kim

Institutions: Samsung (South Korea), Samsung Advanced Institute of Technology (South Korea), Massachusetts Institute of Technology

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405306643

FWCI: 2.485

Cites: 160

Cited by: 127

Related to: 10