Bioinspired supramolecular stress buffer between carbon fiber and epoxy resin for high interfacial performances and toughness of composites
Year: 2025
Type: article
Source: Science China Materials
Authors: Wei Sun, Mingshuo Chen, Hongtao Liu, Yining Wang, Yongping Hou, Mingjie Liu
Institution: Beihang University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408176451