Work

Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs

Year: 2025

Type: conference-paper

Source: International Symposium on Physical Design

DOI: 10.1145/3698364.3705357

Authors: Pruek Vanna-iampikul, Junsik Yoon, Chaeryung Park, Gary Yeap, Sung Kyu Lim

Institutions: Burapha University, Synopsys (United States), Georgia Institute of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408395293

FWCI: 1.706

Cites: 16

Cited by: 1

Related to: 10