Challenges and responses of metrology technologies for the new wave of 3d NAND devices
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3050400
Authors: Dongchul Ihm, Eunpa Kim, Sang Hyun Han
Institution: Samsung Electronics (South Korea)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4409999034