Work

Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures

Year: 2025

Type: article

Source: Microelectronics Journal

DOI: 10.1016/j.mejo.2025.106714

Authors: Yunting Liu, Rong Fu, Meiying Su, Jun Li, Chuan Chen, Fengman Liu

Institutions: Chinese Academy of Sciences, Institute of Microelectronics, University of Chinese Academy of Sciences

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funders: National Natural Science Foundation of China, Chinese Academy of Sciences, National Key Research and Development Program of China, Youth Innovation Promotion Association

Awards: G1182751608, G135804841, G3879608673

OpenAlex ID: W4410060940

FWCI: 0.792

Cites: 30

Cited by: 4

Related to: 10