Work

Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study

Year: 2025

Type: article

Source: Materials Today Nano

DOI: 10.1016/j.mtnano.2025.100631

Authors: Vijay D. Chavan, Touko Lehenkari, Suhas Yadav, Ruhan E. Ustad, Zulfqar Ali Sheikh, Ajay T. Avatare, Tushar P. Kamble, Laraib Sajjad, Hannu-Pekka Komsa, Sandip Sabale, Kyeong-Keun Choi, Seungbae Park, Ghulam Dastgeer, Honggyun Kim, Deok-kee Kim

Institutions: Binghamton University, Sejong University, University of Oulu, Shivaji University, Pohang University of Science and Technology

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: Ministry of Trade, Industry and Energy, National Research Foundation of Korea, Ministry of Science and ICT, South Korea, Korea Evaluation Institute of Industrial Technology

Awards: G1692957625, G6148471229

OpenAlex ID: W4410176535

FWCI: 0.301

Cites: 63

Cited by: 2

Related to: 10