Work

Strain engineering of microfabricated diamond and its applications

Year: 2025

Type: article

Abstract: Diamond is considered the ultimate semiconductor material due to its excellent physical and electrical properties, such as ultrahigh thermal conductivity, ultrawide bandgap, and superhigh carrier mobility. After ultralarge deformation experimentally conducted on diamond in 2018 and 2021, strain engineering is a highly appealing candidate for tuning these properties of diamond, opening up potential applications in microelectronics and quantum technologies. In this review, we briefly review the implementation of strain engineering on diamond, including introducing dynamic strain by nanomechanical tests and maintaining static strain by various methods. We also provide a brief overview of the strain-induced property changes and the specific applications of the strained diamond.

Source: APL Materials

DOI: 10.1063/5.0268185

Authors: Wenjun Liang, Limin Yang, Jiaqi Zhu, Yiling Lian, Yang Lu

Institutions: University of Hong Kong, City University of Hong Kong

Language: English

Topic: Diamond and Carbon-based Materials Research

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,200

Funders: Hunan Provincial Science and Technology Department, Research Grants Council, University Grants Committee