Work

Electromigration Lifetime Improvement of Ball Grid Array Solder Joints for High Performance Computing Applications

Year: 2025

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51687.2025.00260

Authors: Vishnu Shukla, Andrea Molina Moreno, Omar Ahmed, Matthew Ally, Cameron Drewes, Miftahul Nabila, Phoebe Cook, Kaitlyn Munoz, Jeng Hau Huang, Nicholas Rudawski, Peng Su, Leif Hutchinson, Valery Kugel, Bernard Glasauer, Tengfei Jiang

Institutions: University of Central Florida, Juniper Networks (United States), National Taiwan University, University of Florida

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411688994

FWCI: 5.177

Cites: 15

Cited by: 3

Related to: 10