Work

Reliability Assessment Using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3587385

Authors: Gulafsha Bhatti, Yash Agrawal, Vinay S. Palaparthy, Rohit Sharma, Mekala Girish Kumar

Institutions: Dhirubhai Ambani University, Indian Institute of Technology Ropar, VIT-AP University

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Ministry of Electronics and Information technology

Award: G2571784506

OpenAlex ID: W4412374974

FWCI: 1.174

Cites: 33

Cited by: 6

Related to: 10