Work

Suppression of Partial Discharge in Package Insulation Under Square-Wave Voltage by Plasma-Enhanced Film Deposition

Year: 2025

Type: conference-paper

Source: IEEE International Conference on Electrical Materials and Power Equipment (ICEMPE)

DOI: 10.1109/icempe66159.2025.11122997

Authors: Xiuhan Guan, Fengjie Zhang, Junhao Xu, Hongtu Cheng, Yalin Wang, Xi Zhu, Zhi Fang

Institutions: Nanjing Tech University, Shanghai Jiao Tong University, Harbin University of Science and Technology

Language: English

Topic: High voltage insulation and dielectric phenomena

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4413559156

FWCI:

Cites: 7

Cited by:

Related to: 10