Thermal analysis and optimization of high-power GPUs from heat sinks to package interfaces
Year: 2025
Type: article
Source: Applied Thermal Engineering
Authors: Zeng Deng, Yanqiang Sun, Shunlu Zhang, Tiejun Li, Kefan Ma, Zhenwei Wu, Baofeng Li
Institution: National University of Defense Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4413655484
