RF Characterization of New Generations of Bio-Based PCB Substrates in Harsh Environment
Year: 2025
Type: conference-paper
Abstract: This paper presents the RF characterization of the complex permittivity of a novel biosourced PCB substrate, based on a PLA polymer matrix reinforced with a woven flax fiber fabric and laminated copper cladding, as a function of temperature and humidity. The measurements were performed using a cylindrical cavity and resonant transmission lines inside a climate-controlled chamber. Various copper removal techniques were investigated, including peeling, chemical etching, laser ablation, and mechanical milling. To analyze the observed trends on the measurement results, an effective medium model tailored for stratified materials was employed. A particular focus on substrate inhomogeneities has been also investigated for the explanation of the measurement discrepancies.
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4416367403
