Characterization of copper electrodeposited onto palladium from ethaline
Year: 2025
Type: conference-paper
Abstract: Copper (Cu) electrodeposition was carried out onto palladium (Pd) from ethaline, a deep eutectic solvent (DES), based on a mixture of choline chloride and ethylene glycol, containing Cu(II) ions in a potentiostatic mode. Cyclic voltammetry was employed to determine the Cu(II) redox reactions and potentials at which Cu metal deposition is feasible. Potentiostatic electrodeposition was carried out at a relatively low Cu electrodeposition overpotential. Scanning electron microscopy (SEM) results showed that well-defined Cu grains, approximately 3 μm in diameter, with clear boundaries among them, were obtained by Cu electrodeposition onto Pd. Energy-dispersive X-ray spectroscopy (EDS) of Cu electrodeposited on Pd detected the dominant presence of Cu, while X-ray diffraction (XRD) of the deposit identified the formation of face- centred cubic CuPd alloy along with metallic Cu.
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4416632397