Work

Influence of Annealing Temperature on Structure and Electrical Properties of Porous Organosilicate Films

Year: 2025

Type: article

Source: Nano- i Mikrosistemnaya Tehnika

DOI: 10.17587/nmst.27.134-139

Authors: M. Gerelt-Od, T.G. Kolesnikova, A.S. Vishnevskiy, K.A. Vorotilov

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416780293

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