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Latest Developments in Surface Finishing of PCBs Using Plasma Deposition

Year: 2010

Type: article

Source: SMTA International

DOI: 10.37665/smvtmwj54419

Authors: Tim von Werne, Andy Brooks, Siobhan Woollard

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416877005

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