Work

Product Reliability

Year: 2024

Type: article

Source: On-Demand Webinars

DOI: 10.37665/wesvnat67623

Authors: Jean-Paul Clech, Jasbir Bath

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416879656

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Related to: 10