Work

Effect of Dwell Time on the Life of Lead Free BGA Joints in Thermal Cycling

Year: 2009

Type: article

Source: SMTA International

DOI: 10.37665/smaqofz91721

Authors: Peter Borgesen, Emad Al-Momani, Michael Meilunas

Institutions: Binghamton University, Universal Instruments (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416880935

FWCI:

Cites:

Cited by: 1

Related to: 10