Work

A first-principles study on the interfacial behavior of Cu-Sn-Ti brazing alloys with diamond and the effects of Fe, Cr, and Si doping

Year: 2025

Type: article

Source: Diamond and Related Materials

DOI: 10.1016/j.diamond.2025.113164

Authors: Quanbin Du, Xu Liu, Bing Cui, Longxuan Qu, Ang Li, Zhiyu Min, Qian Yang

Institutions: Henan Polytechnic Institute, Anhui University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

Funder: Henan Provincial Science and Technology Research Project

Awards: G4608969161, G5752568752

OpenAlex ID: W4417014653

FWCI: 0.414

Cites: 35

Cited by: 2

Related to: 10