Work

Layered Trench Gate Exhibiting Source/Drain Over-Etch Immunity Without Punch-Through Stopper

Year: 2025

Type: article

Source: IEEE Transactions on Device and Materials Reliability

DOI: 10.1109/tdmr.2025.3642316

Authors: Seungjoon Jeong, Myongjin Kim, Subin Lim, Huiseong Shin, Changhwan Shin

Institution: Korea University

Language: English

Topic: Advancements in Semiconductor Devices and Circuit Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Ministry of Trade, Industry and Energy

Awards: G3092914164, G8468504417, G8636997118

OpenAlex ID: W4417201546

FWCI:

Cites: 21

Cited by:

Related to: 10