Work

Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application

Year: 2006

Type: article

Source: Journal of Welding and Joining

Authors: 하상수, 김종웅, 채종혁, 문원철, 홍태환, 유충식, 문정훈, 정승부

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W520409

FWCI:

Cites:

Cited by: 7

Related to: 9