Low cost large area panel processing of MCM-D substrates and packages
Year: 2001
Type: article
Authors: M. Scheffle, Didier Cottet, Joanna Grzyb, Gerhard Tröster, Kerri Z. Delaney, S. Fuchs, Norbert Ammann, W. Preyss, J. I. Baumbach, P. Poyet, P. Bodö, Peter Leisner, Markku Karlsson, U. Wahlström, S-T. Persson, L. Ljungqvist, Wohlleben Wendel, R. Epple, T. Centro, S. Motto, F. Catarsi, P. Demmer
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W565523409