Work

Non-destructive extraction of width bias variations for deep sub-micron interconnect lines

Year: 2007

Type: conference-paper

Source: International Conference on Solid State Devices and Materials (SSDM)

DOI: 10.7567/ssdm.2007.p-2-11

Authors: Mao-Chyuan Tang, Meng-Feng Wang, Tim Cheng, David Chen, C S Yeh, S C Chien

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W577210789

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