Work

Lead-Free Solder Interconnect Reliability

Year: 2005

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt.2005.21917bae.005

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W653791981

FWCI: 6.148

Cites:

Cited by: 199

Related to: 10