Work

Area Array Package Design

Year: 2003

Type: book

Author: Ken Gilleo

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W658252811

FWCI: 0.726

Cites:

Cited by: 13

Related to: 10