Work

Thermal characterization and design for high performance multichip module type laminate

Year: 1994

Type: book-chapter

Source: Springer eBooks

DOI: 10.1007/978-94-011-1082-2_25

Authors: E. Lauwers, A. Ackaert, K. Allaert, W. Temmerman, W. Nelemans, T. Goossens

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W70155277

FWCI:

Cites: 3

Cited by: 1

Related to: 10