Work

A Physics-Informed Neural Network Surrogate for Runtime PDN and Dynamic Droop Prediction in 2.5-D Chiplet Integration

Year: 2026

Type: article

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems

DOI: 10.1109/tvlsi.2025.3650633

Authors: Xi Chen, Yuhao Ju, Seda Ogrenci, Jie Gu

Institution: Northwestern University

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Science Foundation, Semiconductor Research Corporation

OpenAlex ID: W7128314131

FWCI: 1.754

Cites: 27

Cited by: 1

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