Work

Thermal Dynamics of Aggressively Scaled Redundant Free Robust D Flip-Flop for Next Generation AI and IoT Applications

Year: 2025

Type: conference-paper

Source: IEEE International Conference on Green Industrial Electronics and Sustainable Technologies (GIEST)

DOI: 10.1109/giest66547.2025.11387437

Authors: Syeda Hurmath Juveria, J. Ajayan, Shashank Rebelli

Institution: SR University

Language: English

Topic: Low-power high-performance VLSI design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W7130708263

FWCI:

Cites: 10

Cited by:

Related to: 10