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Sn はんだとCuの界面での反応拡散におけるAgとBi添加の影響

Year: 2024

Type: conference-paper

Source: Institutional Repositories DataBase (IRDB)

Authors: 徳永, 成琉, Tokunaga, Naru, OH, Minho, Oh, Minho, 小林, 郁夫, Kobayashi, Equo

Language: Japanese

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7144635882

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