Work

ALD alumina (Al 2 O 3 )-enabled wafer-level anodic bonding of LTCC and SOI for MEMS integration

Year: 2026

Type: article

Source: Journal of Micromechanics and Microengineering

DOI: 10.1088/1361-6439/ae5e44

Authors: Fikret Yildiz, Dogu Kaan Bugra Ozyigit, Muhammad Rashid Mahmood, Daisuke Nakamura, Günther Weidlinger, Julian Aumaier, Tobias Wernicke

Institutions: Sivas Bilim ve Teknoloji Üniversitesi, University of Waterloo, Bilkent University, EV Group (Austria)

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Türkiye Bilimsel ve Teknolojik Araştırma Kurumu

Award: Optoakustik Görüntüleme ile Sentinel Lenf Nodu Metastazlarının Teşhisi (OpAkSLN)

OpenAlex ID: W7154019362

FWCI:

Cites: 37

Cited by:

Related to: 10