Direct Transfer Bonding of Ultra-thin Warped Chips for Advanced Heterogeneous 3DIC Integration with Fine-pitch Direct/Hybrid Bonding
Year: 2026
Type: conference-paper
Abstract: With advances in AI and HPC, 3D heterogeneous integration increasingly requires the stacking of ultra-thin (less than 10 µm) chips. However, conventional pick-and-place (P&P) methods pose significant challenges for handling such thin, warped chips due to the risk of mechanical damage and suction marks. To overcome these limitations, we propose a total solution called "Direct Transfer Bonding (DTB)" that integrates vacuumless flat tools with active leveling control and specialized carrier tape. This novel approach effectively manages chip warpage and enables a particle-free, non-contact surface process that peels and bonds ultra-thin chips from the tape using a unique peripheral peeling mechanism. In this study, we successfully demonstrate bonding of a highly warped 10-µm-thick silicon chip with a 97% yield. Furthermore, CSAM and STEM/EDS analysis confirmed a high-quality, void-free bonding interface free of organic contamination. These results prove that DTB is a robust and practical technology for high-yield manufacturing of next-generation 3D integrated devices using hybrid bonding
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W7165048366