Work

Optimizing indium bump bonding yield for Micro-LEDs with 8 μm pixel pitch towards mass production

Year: 2026

Type: article

Source: Materials Science in Semiconductor Processing

DOI: 10.1016/j.mssp.2026.110958

Authors: Yuchen Lu, Tianxi Yang, Yijian Zhou, Yang Li, Jin Li, Qun Yan, Jie Sun

Institutions: Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China

Language: English

Topic: GaN-based semiconductor devices and materials

Subfield: Condensed Matter Physics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Wuhan Municipal Science and Technology Bureau

Award: G5647781277

OpenAlex ID: W7167347994

FWCI:

Cites: 14

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